6 layers Hard Auro PCB Board ma 3.2mm laupapa mafiafia ma Counter Sink Pu
Fa'amatalaga Autu
Fa'ata'ita'iga Nu. | PCB-A37 |
afifi felauaiga | Fa'ameamea masima |
Tusipasi | UL, ISO9001&ISO14001,RoHS |
Fa'atatauga | Fa'atau eletise |
Avanoa aupito maualalo/Laina | 0.075mm/3mil |
Gaosi Gaosi | 50,000 sqm/masina |
HS Code | 853400900 |
Amataga | Faia i Saina |
Fa'amatalaga o oloa
HDI PCB Folasaga
HDI PCB ua faauigaina o se laupapa matagaluega lolomi ma se maualuga maualuga uaea density i vaega vaega nai lo se PCB masani.E tele a latou laina ma avanoa, la'ititi vias ma pu'e pads, ma maualuga atu feso'ota'iga pad density nai lo le fa'afaigaluegaina i tekinolosi PCB masani.HDI PCBs e faia e ala i microvias, tanu vias ma sequential lamination ma mea insulation ma conductor uaea mo le maualuga maualuga o routing.
Talosaga
HDI PCB e faʻaaogaina e faʻaitiitia ai le tele ma le mamafa, faʻapea foʻi ma le faʻaleleia o le eletise o le masini.HDI PCB o le mea sili ona lelei e suitulaga i le maualuga layer-count ma taugata tulaga faatonuina laminate po sequentially laminated laupapa.HDI fa'atasi ma tauaso ma tanu vias e fesoasoani e fa'asaoina fanua PCB e ala i le fa'atagaina o foliga ma laina e mamanuina i luga po'o lalo ifo e aunoa ma le faia o se feso'ota'iga.O le tele o tulagavae o le BGA ma le fa'asolo-mata'i lelei i aso nei e le fa'atagaina ai le ta'avale i le va o papa BGA.O ala tauaso ma tanu o le a na'o le fa'afeso'ota'i o fa'a mana'omia feso'ota'iga i lea vaega.
Fa'atekinisi & Avanoa
MEA | AGAFIA | MEA | AGAFIA |
Laupapa | 1-20L | Kopa Mafiafia | 1-6OZ |
Ituaiga Oloa | HF(Ave maualuga) & (Leitio Auala) laupapa, laupapa fa'atonu Imedance, HDIboard, BGA & Fine Pitch laupapa | Solder Mask | Nanya & Taiyo;LRI & Matt Red.lanu meamata, samasama, paepae, lanumoana, uliuli |
Mea fa'avae | FR4(Shengyi Saina,ITEQ, KB A+,HZ),HITG,FrO6,Rogers,Taconic,Argon,Nalco lsola ma isi. | Ua mae'a Lau'ele'ele | HASL masani, HASL e leai se ta'ita'i, FlashGold, ENIG (lmmersion Auro) OSP (Entek), lmmersion TiN, lmmersion Silver, Ma'a'a Auro |
Togafitiga Filifilia Laufanua | ENIG(faatofu Auro) + OSP ,ENIG(faatofu Auro) + Auro Tama'itama, Fa'afofoga Tama'itama Auro, fa'atofuSlive + Tamatama'i Auro, Fa'atofuina Apa + Tama'ilima Auro | ||
Fa'amatalaga Fa'apitoa | Laiti laina lautele/va: 3.5/4mil (leisa fa'ata'ita'i) Pu la'ititi la'ititi: 0.15 mm (vili fa'ainisinia/4 vili leisa vili) Mama Annular aupito maualalo: 4mil Max Mafiafia Kopa: 6Oz Max Gaosiga tele: 600x1200mm Mafiafia laupapa: D/S: 0.2-70mm, Multilayers: 0.40-7.Omm Min Solder Mask Bridge: ≥0.08mm Ituaiga Fa'atusa: 15:1 Fa'afeso'ota'i le mafai gafatia: 0.2-0.8mm | ||
Onosa'i | Pu fa'apalepale: ±0.08mm(min±0.05) Fa'apalepale pu e le fa'apipi'iina: ± O.05min(min+O/-005mm po o le +0.05/Omm) Fa'apalepale otootoga: ±0.15min(min±0.10mm) Su'ega fa'atino: lnsulating tete'e: 50 ohms (masani) Peel off Malosi: 14N/mm Su'ega Stress vevela: 265C.20 sekone Malosi ufimata solder: 6H E-su'ega voltage: 50ov±15/-0V 3os Warp ma mimilo: 0.7%( semiconductor su'ega laupapa 0.3%) |
Fa'aaliga-O a Tatou Oloa Fa'amanuiaga
E sili atu i le 15 tausaga le poto masani gaosi oloa i PCB auaunaga fanua
Ole fua tele ole gaosiga e mautinoa ai ole tau fa'atau e maualalo.
Laina gaosiga alualu i luma fa'amautinoa le lelei mautu ma le umi o le olaga
100% suʻega mo oloa PCB faʻapitoa uma
Auaunaga e tasi, e mafai ona matou fesoasoani e faʻatau vaega
Q/T Taimi Ta'ita'i
Vaega | Taimi Ta'ita'i Vave | Taimi Taimi masani |
Itu-lua | 24 itula | 120 itula |
4 Laupapa | 48 itula | 172 itula |
6 Laupapa | 72 itula | 192 itula |
8 Laupapa | 96itula | 212 itula |
10 Laupapa | 120 itula | 268 itula |
12 Fa'avae | 120 itula | 280 itula |
14 Fa'avae | 144 itula | 292itula |
16-20 Fa'avae | Fa'alagolago i mana'oga fa'apitoa | |
I luga atu o le 20 Layers | Fa'alagolago i mana'oga fa'apitoa |
O le gaioiga a le ABIS e pulea le FR4 PCBS
Sauniuniga Pu
Aveese ma le faaeteete lapisi & fetuutuuna'i ta'otoga masini vili: a'o le'i fa'apipi'i i le 'apamemea, e matua'i gauai atu le ABIS i pu uma i luga o se FR4 PCB ua togafitia e aveese ai otaota, fa'aletonu i luga, ma le epoxy smear, o pu mama e mautinoa le pipii lelei o le ufiufi i puipui pu. .fo'i, i le amataga o le fa'agasologa, e fa'asa'o sa'o le fa'aputuga o masini vili.
Sauniuniga i luga
Deburring ma le faʻaeteete: o matou tagata faigaluega faʻatekonolosi poto masani o le a nofouta i luma o le taimi e na o le pau lava le auala e aloese ai mai se taunuuga leaga o le faʻamoemoeina o le manaʻomia mo le faʻaogaina faʻapitoa ma ia faia ni laasaga talafeagai ina ia mautinoa o loʻo faia ma le faʻaeteete ma saʻo le faagasologa.
Fua Fa'ateleina Fa'avela
O le masani i le faʻaogaina o mea eseese, o le a mafai e le ABIS ona suʻeina le tuʻufaʻatasiga ina ia mautinoa e talafeagai.ona tausia ai lea o le faʻatuatuaina umi o le CTE (coefficient of thermal expansion), faʻatasi ai ma le CTE pito i lalo, o le faʻaitiitia o le faʻapipiʻiina i pu o le a toilalo mai le faʻasolosolo faifai pea o le kopa lea e fausia ai fesoʻotaʻiga i totonu.
Fuaina
O le fa'atonutonuina e le ABIS o le ta'amilosaga e fa'ateleina i pasene ua iloa i le fa'atalitali atu i lenei gau ina ia toe fo'i atu laulau i la latou fua fa'atatau pe a mae'a le ta'amilosaga lamination.fa'apena fo'i, fa'aaogā fa'atonuga fa'afuafua a le kamupani gaosi laminate fa'atasi ma fa'amaumauga o fa'asologa o fa'amaumauga fa'afuainumera i totonu o le fale, e vili-i le fua fa'atatau o le a tumau i le aluga o taimi i totonu o lena siosiomaga fa'apitoa.
Masini
A oʻo mai le taimi e fausia ai lau PCB, ABIS ia mautinoa e te filifilia o loʻo i ai le meafaigaluega saʻo ma le poto masani e gaosia ai
Misiona Lelei a le ABIS
Ole fua ole pasi o mea o loʻo oʻo mai i luga ole 99.9%, o le numera o le tele o le teena o fua faatatau i lalo ole 0.01%.
O fale fa'amaonia a le ABIS e fa'atonutonu uma faiga taua e fa'aumatia uma fa'afitauli a'o le'i gaosia.
O lo'o fa'aogaina e le ABIS polokalama fa'akomepiuta e fa'atino ai su'esu'ega DFM lautele i fa'amaumauga o lo'o o'o mai, ma fa'aogaina faiga fa'atonutonu lelei i le faagasologa o le gaosiga.
E faia e le ABIS le 100% vaʻaia ma suʻesuʻega AOI faʻapea foʻi ma le faia o suʻega eletise, suʻega eletise maualuga, faʻataʻitaʻiga o le faʻaogaina o le impedance, micro-sectioning, suʻega faʻateʻa vevela, suʻega solder, suʻega faʻamaoni, suʻega faʻamaʻi puipui ma suʻega mama ionic.
Tusi Faamaonia
FAQ
O le tele oi latou mai le Shengyi Technology Co., Ltd. (SYTECH), o le na avea ma kamupani lona lua CCL sili ona tele i le lalolagi i tulaga o le faʻatau oloa, mai le 2013 i le 2017. Matou te faʻavaeina sootaga umi o le galulue faʻatasi talu mai le 2006. O le FR4 resin material (Fa'ata'ita'iga S1000-2, S1141, S1165, S1600) e masani ona fa'aogaina mo le faia o laupapa fa'asalalau ta'itasi ma lua-itu fa'apea fo'i laupapa fa'apipi'i.O lo'o sau fa'amatalaga mo lau fa'amatalaga.
Mo FR-4: Sheng Yi, King Board, Nan Ya, Polycard, ITEQ, ISOLA
Mo CEM-1 & CEM 3: Sheng Yi, Tupu Board
Mo Auala Maualuga: Sheng Yi
Mo UV Cure: Tamura, Chang Xing ( * Avanoa lanu: Green) Solder mo le Itu Tasi
Mo Ata Suavai: Tao Yang, Tetee (Ata Ata)
Chuan Yu.
), 1 Itula upusii
b), 2 itula o tali fa'aseā
c), 7 * 24 itula lagolago faʻapitoa
d),7*24 oka auaunaga
e), 7*24 itula tilivaina
f), 7 * 24 gaosiga fa'agasolo
Leai, e le mafai ona matou taliaina faila ata, afai e leai sau faila Gerber, e mafai ona e auina mai ia i matou se faʻataʻitaʻiga e kopi ai.
Fa'asologa o Kopi PCB&PCBA:
O a matou Tulaga Fa'amautinoaga Tulaga e pei ona ta'ua i lalo:
a), Asiasiga Vaaia
b), Su'esu'e lele, meafaigaluega fa'apipi'i
c), Pulea fa'alavelave
d), Su'esu'eina le mafai ona solder
u), fa'ameamea fa'akomepiuta metallo graghic microscope
f), AOI (Automated Optical Inspection)
Ole fua ole taimi ole tu'uina atu e sili atu ile 95%
a), 24 itula vave liliu mo itu lua prototype PCB
b), 48 itula mo 4-8 layers prototype PCB
c), 1 itula mo upusii
d), 2 itula mo fesili enisinia/Fa'asea tali
e), 7-24 itula mo le lagolago faʻapitoa / faʻatonuina auaunaga / gaosiga gaioiga
ABIS e leai se MOQ manaʻomia mo PCB poʻo PCBA.
ABlS faia 100% vaʻaia ma AOl suʻega faʻapea foʻi ma le faʻataʻitaʻiina o le eletise, suʻega eletise maualuga, suʻega faʻafefete, micro-sectioning, suʻega faʻateʻa vevela, suʻega solder, suʻega faʻatuatuaina, suʻega faʻafefete, suʻega mama ionic ma suʻega Faʻatino PCBA.
Alamanuia Autu a ABIS: Pulea Alamanuia, Feso'ota'iga, Oloa Ta'avale ma Foma'i.Maketi Autu a le ABIS: 90% Maketi Fa'avaomalo (40% -50% mo Amerika, 35% mo Europa, 5% mo Rusia ma le 5% -10% mo Asia i Sasa'e) ma le 10% Maketi Fa'alotoifale.
Gaosi gaosiga o oloa vevela-fa'atau | |
Itulualua/Multilayer PCB Workshop | Aluminium PCB Workshop |
Tomai Fa'atekinisi | Tomai Fa'atekinisi |
Meafaitino: CEM-1, CEM-3, FR-4(Tg maualuga), Rogers, TELFON | Meafaitino: Fa'avae alumini, Fa'avae 'apamemea |
Layer: 1 layer i le 20 Layers | Layer: 1 layer ma 2 Layers |
Min.laina lautele/avanoa: 3mil/3mil(0.075mm/0.075mm) | Min.laina lautele/avanoa: 4mil/4mil(0.1mm/0.1mm) |
Min.Pua: 0.1mm(dirilling pu) | Min.Tele pu: 12mil(0.3mm) |
Max.Tele laupapa: 1200mm* 600mm | Tele Fa'atonu: 1200mm* 560mm(47in* 22in) |
Mafiafia laupapa ua mae'a: 0.2mm-6.0mm | Mafiafia laupapa mae'a: 0.3~ 5mm |
apamemea pepa mafiafia: 18um~280um(0.5oz~8oz) | apamemea pepa mafiafia: 35um~210um(1oz~6oz) |
Fa'apalepale Pu NPTH: +/-0.075mm, Fa'apalepale pu PTH: +/-0.05mm | Fa'apalepale tulaga pu: +/-0.05mm |
Otootoga Fa'apalepale: +/-0.13mm | Fa'apalepale fa'asologa fa'asologa: +/ 0.15mm;tu'i auivi fa'apalepale:+/ 0.1mm |
Fa'ai'uga: HASL e leai se ta'ita'i, auro fa'atofu(ENIG), siliva fa'atofu, OSP, u'u auro, tamatama'ilima auro, Vaitusi Carbon. | Fa'auma mae'a: Ta'ita'i fua HASL, fa'atofu auro(ENIG), fa'atofu siliva, OSP ma isi |
Fa'apalepale fa'aletonu: +/-10% | Taofi le mafiafia: +/-0.1mm |
Gaosi gaosiga: 50,000 sqm/masina | MC PCB Gaosia gafatia: 10,000 sqm / masina |