E tusa ai ma le auala faʻapotopotoga, e mafai ona vaevaeina vaega faʻaeletoroni i totonu o le pu ma vaega faʻapipiʻi luga (SMC).Ae i totonu o le alamanuia,Mea Fa'apipi'i Mauga (SMDs) e fa'aaoga atili e fa'amatala ai lenei mea lugavaega lea e fa'aoga i mea fa'aeletonika o lo'o fa'apipi'i sa'o i luga o se laupapa fa'asalalau lolomi (PCB).SMDs e sau i sitaili faʻapipiʻi eseese, ua mamanuina taʻitasi mo faʻamoemoega faʻapitoa, faʻatapulaʻaina avanoa, ma manaʻoga gaosiga.O nisi nei o ituaiga masani o afifi SMD:
1. SMD Chip (Rectangular) afifi:
SOIC (Small Outline Integrated Circuit): O se afifi faatafafa ma gull-apaau e taʻitaʻia i itu e lua, e talafeagai mo taʻaloga tuʻufaʻatasia.
SSOP (Fa'aiti'itia Laititi Outline Package): E tutusa ma le SOIC ae e la'ititi le tino ma sili atu le leo.
TSSOP (Thin Shrink Small Outline Package): O se vaega manifinifi o SSOP.
QFP (Quad Flat Package): O se pusa sikuea poʻo se faʻataʻitaʻi faʻatasi ma taʻitaʻia i itu uma e fa.E mafai ona fa'alilolilo (LQFP) po'o le fa'ata'oto (VQFP).
LGA (Land Grid Array): Leai ni ta'ita'i;nai lo lena, o pads faʻafesoʻotaʻi o loʻo faʻatulagaina i se faʻasologa i luga o le pito i lalo.
2. SMD Chip (Square) afifi:
CSP (Chip Scale Package): E matua fa'apipi'i ma polo solder sa'o i pito o le vaega.Fuafuaina ina ia latalata i le tele o le pu moni.
BGA (Ball Grid Array): Faʻapipiʻi polo faʻapipiʻi i se faʻasologa i lalo o le afifi, e maua ai le faʻaogaina lelei o le vevela ma le eletise.
FBGA (Fine-Pitch BGA): E tutusa ma le BGA ae o loʻo i ai se maualuga sili atu mo le maualuga o vaega.
3. SMD Diode ma Transistor Packages:
SOT (Small Outline Transistor): Laititi afifi mo diodes, transistors, ma isi vaega tu'ufa'atasi laiti.
SOD (Laiti Outline Diode): E tutusa ma le SOT ae faʻapitoa mo diodes.
FAIA (Otootoga Diode): Eseese afifi laiti mo diodes ma isi vaega laiti.
4.SMD Capacitor ma Resistor Packages:
0201, 0402, 0603, 0805, ma isi.: O numera numera ia e faʻaalia ai le tele o le vaega i le sefulu o le milimita.Mo se fa'ata'ita'iga, o le 0603 o lo'o fa'aalia ai se vaega e fua le 0.06 x 0.03 inisi (1.6 x 0.8 mm).
5. Isi SMD Packages:
PLCC (Plastic Leaded Chip Carrier): Fa'atafafa po'o le fa'ailoga fa'afa'afafa'atasi ma ta'ita'i i itu uma e fa, talafeagai mo ICs ma isi vaega.
TO252, TO263, ma isi mea.: O SMD ia o faʻasalalauga faʻapitoa e ala i-pu e pei o TO-220, TO-263, faʻatasi ai ma le pito i lalo mo le faʻapipiʻiina o luga.
O nei ituaiga afifi taʻitasi e iai ona lelei ma faʻaletonu i tulaga o le tele, faigofie o le faʻapipiʻiina, faʻaogaina o le vevela, uiga eletise, ma le tau.Ole filifiliga ole afifi SMD e fa'alagolago ile mea e pei ole galuega ole vaega, avanoa avanoa laupapa, gafatia gaosiga, ma mana'oga vevela.
Taimi meli: Aukuso-24-2023
